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 CYStech Electronics Corp.
P-CHANNEL ENHANCEMENT MODE POWER MOSFET
Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 1/5
MTP3001N3
Description
The MTP3001N3 is a P-channel enhancement-mode MOSFET, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness.
Features
* RDS(ON)=50m@VGS=-10V, ID=-5.3A RDS(ON)=75m@VGS=-4.5V, ID=-4.2A * Simple drive requirement * Low on-resistance * Fast switching speed * Pb-free package
Applications
* Power management in notebook computer, portable equipment and battery powered systems.
Equivalent Circuit
MTP3001N3
Outline
SOT-23 D
GGate SSource DDrain
G
S
MTP3001N3
CYStek Product Specification
CYStech Electronics Corp.
Absolute Maximum Ratings (Ta=25C)
Parameter Drain-Source Breakdown Voltage Gate-Source Voltage Continuous Drain Current @TA=25 C (Note 1) Continuous Drain Current @TA=70 C (Note 1) Pulsed Drain Current (Note 2) Total Power Dissipation @ TA=25 C Operating Junction Temperature Storage Temperature Thermal Resistance, Junction-to-Ambient
Note : 1.Surface mounted on 1 in copper pad of FR-4 board, t10s. 2.Pulse width limited by maximum junction temperature. (Note 1)
Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 2/5
Symbol BVDSS VGS ID ID IDM Pd Tj Tstg Rth,ja
Limits -30 20 -5.3 -4 -20 1.25 -55~+150 -55~+150 50
Unit V V A A A W C C C/W
Electrical Characteristics (Ta=25C) Symbol Min. Typ. Max. BVDSS -30 VGS(th) -1 -1.5 -3 IGSS 100 IDSS -1 60 70 *RDS(ON) 75 90 *GFS 4 7 Ciss 551 Coss 91 Crss 61 td(ON) 10.8 tr 2.3 td(OFF) 23 tf 4 Qg 9.5 Qgs 3.4 Qgd 1.7 ISD -1.7 *VSD -1.3
Unit V V nA A m S pF ns ns ns ns nC nC nC A V
Test Conditions VGS=0, ID=-250A VDS=VGS, ID=-250A VGS=20V, VDS=0 VDS=-24V, VGS=0 ID=-5.3A, VGS=-10V ID=-4.2A, VGS=-4.5V VDS=-15V, ID=-5.3A VDS=-15V, VGS=0, f=1MHz VDD=-15V, ID=-1A, VGS=-10V, RGEN=6, RD=15 VDS=-15V, ID=-5.3A, VGS=-10V, VGS=0V, ISD=-1.7A
*Pulse Test : Pulse Width 380s, Duty Cycle2%
Ordering Information
Device MTP3001N3 Package SOT-23 (Pb-free) Shipping 3000 pcs / Tape & Reel Marking 01
MTP3001N3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
On-Resistance vs Gate Voltage
250 RDSON, On - Resistance (m)
-ID=5.3A
Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 3/5
On Resistance vs Drain Current
140 120 100
VGS=-4.5V
RDSON, On-Resistance(m)
200
150
80 60 40 20
VGS=-10V
100
50
0 1 2 3 4 5 6 7 8 9 10 -VGS , Gate-to-Source Voltage(V)
0
3
6 9 ID , Drain Current (A)
12
15
Power Dearting Curve
1.5 1.25 PD, Power Dissipation(W) 1 0.75 0.5 0.25 0 0 25 50 75 100 125 150 TA , Ambient Temperature()
MTP3001N3
CYStek Product Specification
CYStech Electronics Corp.
Reel Dimension
Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 4/5
Carrier Tape Dimension
MTP3001N3
CYStek Product Specification
CYStech Electronics Corp.
SOT-23 Dimension
A L 3 B 1 2 S
Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 5/5
Marking:
TE 01
V
G
3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Style: Pin 1.Gate 2.Source 3.Drain
C D K
H
J
*: Typical
DIM A B C D G H
Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040
Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10
DIM J K L S V
Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256
Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
* Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTP3001N3
CYStek Product Specification


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